A high-level delegation led by James M. McKelvey Prof. Aaron BOBICK, Dean of McKelvey School of Engineering (McKelvey Engineering) of Washington University in St Louis (WashU), visited the Hong Kong University of Science and Technology (HKUST) on September 20, 2019 to sign a memorandum of understanding (MoU) to establish a framework within which cooperation may develop between the two leading universities in the world.

The MoU focuses on collaboration between McKelvey Engineering at WashU and the School of Engineering (SENG) at HKUST in order to benefit their research and teaching activities in the field of engineering and to further the internationalization of both institutions. The preliminary plan is to explore joint research activities, including seminars, conferences and public lectures, and establish joint projects through collaborative education programs to facilitate student exchange.

Apart from the Dean of McKelvey Engineering, who was present to sign the MoU, the delegates also included senior management at WashU, namely Prof. Bruno SINOPOLI, Chair of Department of Electrical and Systems Engineering and Das Family Distinguished Professor; Mr. Nick BENASSI, Senior Associate Dean and Chief of Staff; and Ms. Teresa SARAI, Assistant Dean for International Relations.

The delegates were greeted by the HKUST counterparts, including Prof. Albert IP, Council Member; Prof. Tim CHENG, Dean of Engineering; Prof. CHENG Siu-Wing, Associate Dean of Engineering (Undergraduate Studies); Prof. Richard SO, Associate Dean of Engineering (Research & Graduate Studies); Prof. Bert SHI, Head of Department of Electronic & Computer Engineering; and Prof. Terence WONG, Assistant Professor of Department of Chemical & Biological Engineering, among others.

Founded in 1853, WashU is among the world’s leaders in teaching, research, patient care, and service to society. It was ranked No.32 in the U.S. News Best Global Universities Rankings 2018 and No.52 in the Times Higher Education World University Rankings 2020.