Flip Chip Technologies and Wafer-Level Chip Scale Packaging; Through Silicon Vias (TSV) and 3D Packaging; Passive Alignment of Optical Fibers; LED Packaging and Solid State Lighting; Lead-free Soldering and Solder Joint Reliability; Computational Modeling and Stress Analysis.
Ricky Lee received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University. Currently he is Chair Professor of Mechanical and Aerospace Engineering and Director of Center for Advanced Microsystems Packaging at HKUST. He also serves as Director of HKUST Shenzhen Electronic Materials & Packaging Laboratory. In addition, Ricky is Editor-in-Chief of IEEE Transactions on Components & Packaging Technologies.