Prof. Ricky LEE Received Outstanding Sustained Technical Contribution Award of IEEE Electronics Packaging Society
Prof. Ricky Lee said the award is very meaningful to him because it recognizes his cumulative technical contributions to the electronics packaging community in the past two decades. [Download Photo]
Chair Professor Ricky Shi-Wei LEE, Mechanical and Aerospace Engineering, is named the 2019 recipient of the Outstanding Sustained Technical Contribution Award by the IEEE Electronics Packaging Society (EPS). He is recognized for “two decades of continuous contributions and professional leadership in multiple technical fields encompassed by EPS, including solder joint reliability, lead free transition 3D IC integration, and LED packaging”.
“This award is very meaningful to me because it recognizes my cumulative technical contributions to the electronics packaging community in the past two decades. I would like to thank all my group members over the years. Without them, I won’t be able to achieve all these,” Prof Lee said.
Prof. Lee has been focusing his research on the development of packaging and assembly technologies for electronics and optoelectronics. His research interests include wafer level packaging and 3D IC integration, through silicon vias (TSV) and high density interconnects, LED packaging for solid-state lighting, lead-free soldering and reliability analysis.
Over the years, his technical contributions has been recognized by 12 best/outstanding paper awards and six major professional society awards, including this latest one from EPS. He is a Fellow of Institute of Electrical and Electronics Engineers (IEEE), American Society of Mechanical Engineers (ASME), International Microelectronics Assembly and Packaging Society (IMAPS), and Institute of Physics (UK).
Currently, he also serves as the Associate Dean of Fok Ying Tung Graduate School, Director of HKUST Shenzhen Research Institute, Director of Center for Advanced Microsystems Packaging at HKUST, and Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong.
The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing. Its Outstanding Sustained Technical Contribution Award recognizes outstanding sustained and continuing contributions to the technology in fields encompassed by the EPS.