The HKUST Remotely Operated Vehicle (ROV) Team was crowned the All-Around Champion and Engineering Presentation Champion in the MATE International ROV Competition 2019. This marks the second time that the team receives all-around championship in this international competition since they first participated in 2011, after the first time in 2017.
Three School of Engineering faculty members were honored in the Ministry of Education’s 2018 Higher Education Outstanding Scientific Research Output Awards (Science and Technology). These significant national awards recognize leading contributions to scientific discovery and technological innovation carried out in tertiary institutions across China.
The Hong Kong University of Science and Technology (HKUST) and Xunlei Limited (“Xunlei” or the Company) (Nasdaq: XNET) today announced the establishment of HKUST-Xunlei Joint Laboratory on Blockchain Technology.
The Inamori Foundation, Kyoto, Japan announced that Prof. TANG Ching-Wan, IAS Bank of East Asia Professor of The Hong Kong University of Science and Technology, is the recipient of the 2019 Kyoto Prize in Advanced Technology.
The HKUST Remotely Operated Vehicle (ROV) Team defended their champion title in the 14th Hong Kong Regional of the MATE International ROV Competition. The ROV Team, a sub-team of the HKUST Robotics Team, has been named champion in this competition for the ninth consecutive year.
Chair Professor Ricky Shi-Wei LEE, Mechanical and Aerospace Engineering, is named the 2019 recipient of the Outstanding Sustained Technical Contribution Award by the IEEE Electronics Packaging Society (EPS).
Dr. YU Xianghao, a 2018 PhD graduate from the Department of Electronic and Computer Engineering (ECE), has been named the winner of the School of Engineering (SENG) PhD Research Excellence Award 2018-19.
Fang Professor of Engineering Prof. Kei May LAU, Chair Professor of Electronic and Computer Engineering, was elected a 2019 Fellow by The Optical Society (OSA) for “exceptional contributions to hetero-epitaxy of III-V on silicon by MOCVD for photonic devices”.